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Directive bans the use of lead (Pb), mercury (Hg),
cadmium (Cd) and hexavalent chromium (Cr 6) in
soldering material and the use of Polybrominated
biphenyl (PBB) and Polybrominated diphenyl ether
(PBDE) in substrate materials or mold compounds
for equipment put in circulation inside the European
Union after July 1, 2006.
The parts currently delivered by
austriamicrosystems AG are already free of Hg,
Cd, Cr 6, PBB and PBDE. Pb, however, is contained
in the pin coating substance and we have therefore
implemented a Pb-free/RoHS compliance program.
Part of this program is the re-qualification of
all packages to ensure the same high quality and
reliability level. These qualifications will be
finished by end of 2004.
Production parts will be available
at the beginning of 2005, Engineering Samples
for PCB soldering evaluation can be delivered
before, if required.
For ASICs which are already in production,
the transition period will mainly depend on your
own planning. The last packages containing Pb
should, however, be delivered not later than mid/end
of 2005.
If you have any further questions
regarding the Pb-free/RoHS compliance program
at austriamicrosystems AG, please do not hesitate
to contact us at pb-free@austriamicrosystems.com.
Frequently asked questions are also answered and
relevant technical issues can be read on our Website.
Sincerely,
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