Assemble and test your product
Discuss your backend needs with us:
Based on many years of test experience austriamicrosystems has built extensive test IP which contributes significantly to fulfill our customers tight time-to-market requirements.
- Test program development
- Test capabilities for high voltage, low current, mixed-signal RF, digital high speed, ultra-low distortion audio and opto-electrical test
- In-house ceramic assembly for fast prototyping of first engineering samples
- Plastic assembly: Our portfolio of qualified packages reaches from standard packages to systems-in-package modules to FlipChip and other chip scale packages.
- Yield Stability & enhancement
- Failure Analysis
Take RoHS compliance for granted:
austriamicrosystems successfully implemented Pb-free (lead-free) packaging for all of its products, according to EU directive 2002/95/EG (RoHS directive). Since beginning of 2005 all production parts have been delivered in Pb-free packages.