200 mm Production Line
Technological development is progressing towards ever smaller geometries "deep sub micron" enabling the integration of complete integrated electronic systems on a single chip ("system-level integration"). With a view to the future such products can only be realized on a 200 mm line.
Our specialized processes, such as high-voltage CMOS, BiCMOS and SiGe-BiCMOS, offer a unique process base for Application Specific Integrated Circuits (ASIC) and Application Specific Standard Products (ASSP) products that are exceptionally challenging from a technical manufacturing point of view. The realization of the new production line allows these special technologies to be produced with geometries in the range of 0.8 µm and 0.35 µm. The new facility is prepared to develop and manufacture future technology generations down to 0.18µm.
Capacity
The new production line offers a maximum capacity of 3,000 Wafer Starts per Week (WSPW) with a clean room floor area of 2,600 square meters.
Production has started in January 2002 with a capacity of 2400 WSPM (Wafer starts per Month), the currently installed capacity is 8000 WSPM.