Wafer Sort and Final Test Capabilities
austriamicrosystems offers complete turn-key test solutions for wafer sort and packaged part testing for a wide range of production testing features including:
- high voltage
- low current
- ultra low distortion audio
- integrated sensors (e.g. hall sensors, optical sensors)
- complex mixed-signal RF and digital high speed
austriamicrosystems has a highly experienced team of experts in the areas of mixed analog/digital testing and high-voltage and RF testing. They provide flexible production feasibility and innovative solutions for customer test demands. A modern, special platform enables complex system-on-chip circuit testing and guarantees high throughput for the testing of wafers and assembled components.
The finished chip is subjected to a final test in order to ascertain that the customer's specifications have been achieved. All mechanical procedures on the testers are fully automatic and free from manual interference - a further guarantee for high and stable product output quality. Test procedures are modified according to whether the products are for commercial, industrial or high reliability applications. Appropriate test programs are also available for various temperature ranges. The test facilities are unmatched in the industry, especially in the field of mixed signal circuits.
Expanded RF test capabilities from basic source and measure to vector network measurements such as S parameter enable full test coverage for single-chip transceivers, LNAs, Mixers, power amplifiers, IQ modulators and demodulators, synthesizers, PLLs, and more.
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FUSION AC / HT / HF |